this is information on a product in full production. april 2012 doc id 023120 rev 1 1/8 8 stps30m60djf high efficiency power schottky diode datasheet ? production data features very low conduction losses low forward voltage drop low thermal resistance high specified avalanche capability high integration ecopack ? 2 compliant component description the stps30m60djf is a power schottky rectifier, suited for high frequency switch mode power supply and dc to dc converters. packaged in powerflat?, this device is intended to be used in notebook, game station and desktop adapters, providing in these applications a good efficiency at both low and high load. its low profile was especially designed to be used in applications with space-saving constraints. tm: powerflat is a trademark of stmicroelectronics table 1. device summary symbol value i f(av) 30 a v rrm 60 v v f (typ) 0.46 v t j (max) 150 c k a a a k k a powerflat 5x6 stps30m60djf www.st.com
characteristics stps30m60djf 2/8 doc id 023120 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.55 x i f(av) + 0.004 x i f 2 (rms) table 2. absolute ratings (limiting values, anode terminals 1 and 3 short circuited) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 45 a i f(av) average forward current = 0.5 t c = 100 c 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a p arm (1) 1. more details regarding the avalan che energy measurements and diod e validation in the avalanche are provided in the stmicroelectronics ? application notes an1768 and an2025. repetitive peak avalanche power 3500 w v arm maximum repetitive peak avalanche voltage t p < 1 s, t j < 150 c i ar < 13 a 80 v t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (2) 2. condition to avoid thermal r unaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.0 c/w table 4. static electrical characteristics (anode terminals short circuited) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm - - 90 a t j = 125 c - 20 50 ma v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 15 a - - 0.59 v t j = 125 c - 0.46 0.52 t j = 25 c i f = 30 a - - 0.72 t j = 125 c - 0.57 0.67 dptot dtj < 1 rth(j-a)
stps30m60djf characteristics doc id 023120 rev 1 3/8 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0 5 10 15 20 25 30 0 5 10 15 20 25 30 35 40 = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) f(av) t = t / t p t p i (a) f(av) 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 t = t / t p t p r= r th(j-a) th(j-c) t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration i (a) m 0 40 80 120 160 200 240 280 1.e-03 1.e-02 1.e-01 1.e+00 i m t = 0.5 t(s) t = 125 c c t = 75 c c t = 25 c c z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p
characteristics stps30m60djf 4/8 doc id 023120 rev 1 figure 11. reverse safe operating area (t p < 1 s and t j < 150 c) figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) figure 9. forward voltage drop versus forward current figure 10. thermal resistance junction to ambient versus copper surface under tab 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 5 10 15 20 25 30 35 40 45 50 55 60 t = 25 c j t = 50 c j t = 75 c j t = 125 c j t = 150 c j t = 100 c j i (ma) r v (v) r 100 1000 10000 1 10 100 f = 1 mhz v = 30 mv t = 25 c osc rms j c(pf) v (v) r i (a) fm 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t = 125 c (maximum values) j v (v) fm t = 25 c (maximum values) j t = 125 c (typical values) j 0 50 100 150 200 250 012345678910 r (c/w) th(j-a) s (cm2) cu epoxy printed board fr4, copper thickness = 35 m i (a) arm 5 10 15 20 60 65 70 75 80 85 90 95 100 105 110 v arm
stps30m60djf package information doc id 023120 rev 1 5/8 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. footprint (dimensions in mm) table 5. powerflat 5x6 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
package information stps30m60djf 6/8 doc id 023120 rev 1 figure 13. tape and reel specifications dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 8.0 6.30 2.0 12.0 5.30 1.75 5.5 ? 1.55 ? 1.5 0.20 1.20 0.30 r 0.50
stps30m60djf ordering information doc id 023120 rev 1 7/8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS30M60DJF-TR ps30 m60 powerflat 5x6 95 mg 3000 tape and reel table 7. document revision history date revision changes 18-apr-2012 1 first issue.
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